high voltage npn transistor apt17 data sheet 1 aug. 2011 rev 1. 4 bcd semiconductor manufacturing limited general description the apt17 is high voltage, small signal npn transis- tor. the apt17 is available in sot-23 and to-92 pack- ages. features high collector-emitt er voltage: 480v applications high voltage and low standby power circuit for bcd solution figure 1. package types of apt17 figure 2. pin configurations of apt17 (top view) pin configuration z package ( to-92 ( bulk packing )) base emitter collector 1 2 3 to-92 ( bulk packing ) to-92 ( ammo packing ) sot-23 12 3 n package ( sot-23 ) (to-92 ( ammo packing)) emitter collector base base emitter collector 1 2 3
high voltage npn transistor apt17 data sheet 2 aug. 2011 rev 1. 4 bcd semiconductor manufacturing limited parameter symbol value unit collector-emitter voltage (v be =0) v ces 700 v collector-emitter voltage (i b =0) v ceo 480 v emitter-base voltage (i c =0) v ebo 10 v collector current i c 50 ma collector peak current (pulse) i cm 100 ma base current i b 25 ma base peak curre nt (pulse) i bm 50 ma power dissipation, t a =25 o c sot-23 p tot 0.2 w to-92 0.5 operating junction temperature 150 o c storage temperature range -55 to 150 o c ordering information package part number marking id packing type sot-23 APT17NTR-G1 gd8 tape & reel to-92 apt17z-g1 apt17z-g1 bulk apt17ztr-g1 apt17z-g1 ammo circuit type g1: green apt17 - tr: tape & reel or ammo blank: bulk package absolute maximum ratings (note 1) z: to-92 n: sot-23 bcd semiconductor's products, as designated with "g1" suffix in the part number, are rohs compliant and green. note 1: stresses greater than those li sted under "absolute maximu m ratings" may cause permanen t damage to the device. these are stress ratings only, and functiona l operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to "absolut e maximum ratings" for extended periods may affect device reliability.
high voltage npn transistor apt17 3 aug. 2011 rev 1. 4 bcd semiconductor manufacturing limited data sheet parameter symbol value unit thermal resistance (junction-to-ambient) sot-23 ja 625 o c/w to-92 250 thermal characteristics parameter symbol conditions min typ max unit collector cut-off current (v be =-1.5v) i cev v ce =700v 10 a collector-emitter sustaining vo l t a g e ( i b =0) v ceo (sus) i c =300 a 480 v dc current gain h fe i c =100 a, v ce =20v 21 36.5 i c =500 a, v ce =20v 24.5 35.5 i c =10ma, v ce =20v 20 45.5 ( t c =25 o c, unless otherw ise specified.) electrical characteristics
high voltage npn transistor apt17 data sheet 4 aug. 2011 rev 1. 4 bcd semiconductor manufacturing limited typical performance characteristics 1e-4 1e-3 0.01 0.1 0 5 10 15 20 25 30 35 t j =25 0 c t j =125 0 c collector current i c (a) dc current gain h fe v ce =20v v ce =20v figure 3. dc current gain 20 40 60 80 100 120 1e-3 0.01 0.1 1 10 100 t j =150 0 c t j =125 0 c t j =75 0 c t j =25 0 c instantanous reverse current ( m a ) percent of collector-emitter reverse voltage(%) figure 4. typical reverse characteristics 1101001000 0.1 0.01 0.001 collector-emitter clamp voltage v ce (v) collector current ic(a) 0.0001 package: sot-23 figure 5. safe operating areas figure 6. safe operating areas 10 100 1000 1 0.1 0.01 0.001 collector-emitter clamp voltage v ce (v) collector current ic(a) 0.0001 package: to-92
high voltage npn transistor apt17 5 aug. 2011 rev 1. 4 bcd semiconductor manufacturing limited data sheet mechanical dimensions unit: mm(inch) sot-23
high voltage npn transistor apt17 data sheet 6 aug. 2011 rev 1. 4 bcd semiconductor manufacturing limited unit: mm(inch) to-92 ( bulk packing ) mechanical dimensions (continued) 2.420(0. 095) 2.660(0.105) 0.360(0. 014) 0.760(0. 030) 1. 600(0. 063) max 12.500(0.492) 15.500(0.610) 1.270(0. 050) typ 3.300(0.130) 3.700(0.146) 4.300(0.169) 4.700(0.185) 1.000(0. 039) 1.400(0. 055) 4.400(0.173) 4.800(0.189) 3.430(0.135) min 0.320(0. 013) 0.510(0. 020) 0. 000(0. 000) 0. 380(0. 015)
high voltage npn transistor apt17 7 aug. 2011 rev 1. 4 bcd semiconductor manufacturing limited data sheet to-92 ( ammo packing ) unit: mm(inch) mechanical dimensions (continued) 4.300(0.169) 4.700(0.185) 1 2.500(0.492) 1 4.500(0.571) 2.540(0. 100 ) ty p 1.270(0.050 ) typ 0. (0. 015) 0. 550 (0.022 ) 4.400(0. 173 ) 4. 800 ( 0. 189 ) 3. 430(0. 135 ) min 0.320(0. 013 ) 0 . 510(0. 020) 0. 000(0.000 ) 0. 380(0. 015 ) max 1. 100(0. 043 1. 400(0. 055 ) 3.300(0.130) 3.800(0.150) 1. 600(0. 063) ) 380 2.500(0. 098 ) 4.000 ( 0.157 ) 13.000(0. 512 ) 15.000 ( 0.591 )
high voltage npn transistor apt17 data sheet 8 aug. 2011 rev 1. 4 bcd semiconductor manufacturing limited soldering information 3.30 1.0 0.60 (3x ) 0.50(3x ) 2.90 2.50 1.30 1.70 2.70 0.60 (3 x ) sol der lands sol der r esi st sol der p aste o ccupi ed a rea di mensi ons i n m m figure 7. reflow soldering footprint sot-23
high voltage npn transistor apt17 9 aug. 2011 rev 1. 4 bcd semiconductor manufacturing limited data sheet soldering information(continued) sol der lands sol der r esi st o ccupi ed a rea di m ensi ons i n m m p referred transport di re c ti on duri ng sol deri ng 1.20 4.00 4.50 2.80 figure 8. waving soldering footprint sot-23
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited
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